ydtsen@ieee.org
Careers
- Industry Mentor, Department of Industrial Management, National Taiwan University of Science and Technology (2024~now)
- Manager of Intelligent Manufacturing Center, tsmc, (2007~2022, retired)
Publications
- "Integrated Hierarchical Reinforcement Learning for Enhanced CMP Manufacturing Efficiency." TechRxiv. December 17, 2025.
- "Deep Hierarchical Reinforcement Learning CMP Run to Run Control." International Conference on Flexible Automation and Intelligent Manufacturing. Cham: Springer Nature Switzerland, 2024.
- "Reinforcement learning chemical-mechanical polishing run-to-run controller." 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE). IEEE, 2023.
- "Predictive control of quality in batch polymerization using hybrid ANN models." AIChE Journal 42.2 (1996): 455-465.
- System and method for implementing a virtual metrology advanced process control platform, US patent: US-8437870-B2, 2013
- System and method for implementing multi-resolution advanced process control, US patent: US-8394719-B2, 2013
- Method and system for implementing virtual metrology in semiconductor fabrication, US patent: US-8396583-B2, 2013
- Advanced process control with novel sampling policy, US patent: US-8392009-B2, 2013
- Advanced process control for new tapeout product, US patent: US-8239056-B2, 2012
- Method and system for tuning advanced process control parameters, US patent: US-8229588-B2, 2012
- Method and apparatus for advanced process control, US patent: US-8224475-B2, 2012
- System and method for implementing wafer acceptance test ("WAT") advanced process control ("APC") with routing model, US patent:US-8219341-B2, 2012
- System and method for implementing a wafer acceptance test ("WAT") advanced process control ("APC") with novel sampling policy and architecture, US patent: US-8108060-B2, 2012
- Method for a bin ratio forecast at new tape out stage, US patent: US-8082055-B2, 2011
- Method for bin-based control, US patent: US-8041451-B2, 2011
- METHOD AND SYSTEM FOR IMPLEMENTING VIRTUAL METROLOGY IN SEMICONDUCTOR FABRICATION, US patent: US-20110238198-A1, 2011
- SYSTEM AND METHOD FOR IMPLEMENTING MULTI-RESOLUTION ADVANCED PROCESS CONTROL, US patent: US-20110213478-A1, 2011
- System and method for implementing multi-resolution advanced process control, US patent: US-7951615-B2, 2011
- ADVANCED PROCESS CONTROL FOR NEW TAPEOUT PRODUCT, US patent: US-20110112678-A1, 2011
- METHOD FOR A BIN RATIO FORECAST AT NEW TAPE OUT STAGE, US patent: US-20110010215-A1, 2011
- SYSTEM AND METHOD FOR IMPLEMENTING A VIRTUAL METROLOGY ADVANCED PROCESS CONTROL PLATFORM, US patent: US-20100312374-A1, 2010
- SYSTEM AND METHOD FOR IMPLEMENTING A WAFER ACCEPTANCE TEST ("WAT") ADVANCED PROCESS CONTROL ("APC") WITH NOVEL SAMPLING POLICY AND ARCHITECTURE, US patent: US-20100292824-A1, 2010
- METHOD FOR BIN-BASED CONTROL, US patent: US-20100268367-A1, 2010
- SYSTEM AND METHOD FOR IMPLEMENTING MULTI-RESOLUTION ADVANCED PROCESS CONTROL, US patent: US-20100255613-A1,2010
- SYSTEM AND METHOD FOR IMPLEMENTING WAFER ACCEPTANCE TEST ("WAT") ADVANCED PROCESS CONTROL ("APC") WITH ROUTING MODEL, US patent: US-20100250172-A1, 2010
- ADVANCED PROCESS CONTROL WITH NOVEL SAMPLING POLICY, US patent: US-20100249974-A1, 2010
- METHOD AND APPARATUS FOR ADVANCED PROCESS CONTROL, US patent: US-20100234970-A1, 2010
- METHOD AND SYSTEM FOR TUNING ADVANCED PROCESS CONTROL PARAMETERS, US patent: US-20100228370-A1, 2010