About Dr. Tsen
Career
- Senior Project Consultant, Taiwan-Singapore IP Science and Technology Innovation Center, National Taiwan University of Science and Technology (NTUST), Taiwan, from 2024
- Manager of Intelligent Manufacturing Center, Taiwan Semiconductor Manufacturing Co. (tsmc), 2007~2022 (retired)
- Postdoc of ChE Dep. of National Tsing Hua University (NTHU), Taiwan, 1997
- Ph.D of ChE Dep. of National Tsing Hua University (NTHU), Taiwan, since 1995
- Visiting scholar of ChE Dep. of Washington University in St Louis (WUST), US, 1993
Publications
- Deep Hierarchical Reinforcement Learning CMP Run to Run Control. International Conference on Flexible Automation and Intelligent Manufacturing. Springer, Cham, 2024
- Reinforcement Learning Chemical-mechanical Polishing Run-to-Run Controller, 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE), 2023
- INTRA-FIELD PROCESS CONTROL FOR LITHOGRAPHY, TW Patent I711888, 2020
- METHOD AND/OR SYSTEM FOR CHEMICAL MECHANICAL PLANARIZATION (CMP), TW Patent I633969, 2018
- CALIBRATION APPARATUS AND ADJUSTMENT METHOD FOR ADJUSTING ILLUMINATION DEVICE OF LITHOGRAPHY APPARATUS, TW Patent I582547, 2017
- EXPOSING CORRECTION METHOD AND CONTROL APPARATUS, TW Patent I521313, 2016
- METHODS OF AUTOMATIC BOUNDARY CONTROL FOR SEMICONDUCTOR PROCESSES, TW Patent I496019, 2015
- ADVANCED PROCESS CONTROL METHOD AND SYSTEM, TW Patent I410822, 2013
- A novel multiple resolution APC on CMP and Litho-Etching, 2013 e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
- METHOD FOR BIN-BASED CONTROL, TW Patent I402762, 2013
- METHOD AND APPARATUS FOR ADVANCED PROCESS CONTROL, TW Patent I399625, 2013
- Method and system for implementing virtual metrology in semiconductor fabrication, US Patent US-8396583-B2, 2013
- System and method for implementing multi-resolution advanced process control, US Patent US-8394719-B2, 2013
- System and method for implementing a virtual metrology advanced process control platform, US Patent US-8437870-B2, 2013
- Advanced process control with novel sampling policy, US Patent US-8392009-B2, 2013
- SYSTEM AND METHOD FOR IMPLEMENTING MULTI-RESOLUTION ADVANCED PROCESS CONTROL, TW Patent I392987, 2013
- Advanced process control for new tapeout product, US Patent, US-8239056-B2, 2012
- Method and system for tuning advanced process control parameters, US Patent US-8229588-B2
- Method and apparatus for advanced process control, US Patent US-8224475-B2, 2012
- System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) with routing model, US Patent US-821934, 2012
- System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture, US Patent US-8108060-B2, 2012
- Method for a bin ratio forecast at new tape out stage, US Patent US-8082055-B2, 2011
- Method for bin-based control, US Patent US-8041451-B2, 2011
- A Rosebrock’s diagonal dominance study on multiple resolution APC, 2011 e-Manufacturing & Design Collaboration Symposium & International Symposium on Semiconductor Manufacturing (eMDC & ISSM), 2011
- System and method for implementing multi-resolution advanced process control, US Patent US-7951615-B2, 2011
- Method using artificial intelligence neural network to proceed on-line real-time optimization for furnace and system, TW Patent I230868, 2005
- Predictive control of quality in batch polymerization using hybrid ANN models, AIChE journal, 1996